Method of and means for mending fabric



June 23, 1964 c. K. HlRscH METHOD OF' AND MEANS FOR MENDING FABRIC FiledOct. 25, 1960 Sdi i haal-*Softem udha lu INVENTOR.'

CHARLES K. PHRSCH /-f /lf AGENT United States Patent O 3,138,505 METHODF AND MEANS FOR MENDING FABRIC Charles K. Hirsch, 195 Claremont Ave.,New York, N.Y. Filed Oct. 25, 1960, Ser. No. 64,917 4 Claims. (Cl.156-94) My present invention relates to the mending of fabrics and hasas its general object the provision of an improved method of and meansfor patching textile materials and the like.

While so-called iron-on tapes have long been used toy patch holes infabrics, they have many disadvantages. Such tapes generally comprise afabric patch coated on one side with a thermally effective plasticadhesive which is applied to the inner surface of the fabric to bemended. The plastic adhesive is then fused to the fabric by theapplication of heat and moderate pressure (eg. from a common householdiron). When such tapes are used, however, the glossy undersurface of thefactory-applied plastic adhesive shows through the hole in the mendedfabric. The great diversity in the types of fabric which may requirepatching from time to time necessitates the stocking of a large varietyof mending tapes and, although a particular type may have been of theproper color for a certain mending purpose, it was always difiicult tomatch the weaves or designs of the fabric to be patched with the mendingmaterial. Furthermore, the impermeability of the adhesives used iniron-on tapes between the patch and the fabric renders the patched areathereof impenetrable by fluids (eg. dyestuffs, cleaning solvents) andprevents its satisfactory treatment by fluids; this also has theundesirable effect of impeding the evaporation of body perspiration whenthe fabric is part of a garment and the patch covers a large area.

It is, therefore, a more specific object of my invention to provide amethod of patching fabrics whereby the patched region retains apermeability to fluids approaching that of the unpatched regions of theoriginal fabric.

Another specific object of the invention is to provideV a thermallyactivatable patching material adapted to match the fabric to be patchedwhich is suitable for large-scale mending as well as for householdpatching applications and which can be applied equally well to eitherthe wrong or the right side of such fabric.

According to a feature of the invention, I provide a heat-responsive(preferably thermoplastic) adhesive backed by a substrate which mayv bestripped therefrom. The adhesive may be applied to a patching fabric bythe application of heat, whereupon the substrate may be removed and theadhesive-coated patch applied to the inner surface of a fabric to bemended. Advantageously, a thermosensitive release agent is interposedbetween the adhesive and the substrate (eg. as a surface coating on thelatter) to facilitate the removal of the latter after application of theadhesive to the p-atch. The adhesive carried on the substrate is,according to a more particular feature of the invention, provided with amultiplicity of perforations adapted to assure the permeability of thepatch after the latter is applied to the fabric. The perforations, whichmay, for example, be punched or drilled into the adhesive-coatedsubstrate, are sufiiciently numerous to provide a penetrability tofluids comparable to that of the unpatched areas of the fabric.

According to another more specific feature of the invention, theadhesive-coated substrate is provided with a hole substantially matchingin size and configuration the hole in the fabric to be mended. Theadhesive is then thermally fused to a patch of the same or similarfabric whereupon the substrate is removed. The patch is then ICC appliedover the hole in the fabric, the design and weave of the patch beingaligned with that of the fabric surrounding the hole therein. The weaveand design of the patch, revealed through the aligned holes in thefabric and the adhesive, will then blend with that of the fabric whilethe adhesive, fusing the patch to the fabric about the perimeter of thepatched hole, prevents the unraveling of the threads along thisperimeter. It should also be noted that the adhesive-coated substratecan be provided with a preformed hole, the adhesive lm being suitablefor patching holes and rents smaller than the preformed hole.

The thermally activatable adhesive, which may be a polymericheat-softening adhesive, may be cast, sprayed or otherwise deposited onthe substrate. The latter may be a paper treated with a heat-responsiverelease agent such as wax, a silicone or the like. In addition tomechanical techniques (drilling and punching) for perforating theadhesive fihn on the substrate, bombardment by particles from aradioactive source, electric-spark techniques and chemical treatment mayalso be used to render porous the polymeric film.

The above and other objects, features and advantages of my presentinvention will become more readily apparent from the followingdescription, reference being made to the accompanying drawing in which:

FIG. 1 is a plan view of a fabric mended in accordance with myinvention;

FIG. 2 is a cross-sectional view taken along line lI-II of FIG. 1;

FIG. 3 is a view similar to FIG. l of the bonding film used in formingthe patch;

FIG. 4 is a cross-sectional view of a patch according to the inventionalong the line IV-IV of FIG. 3, illustrating one stage in thepatch-forming process;

FIG. 5 is a View similar to FIG. 4 of a patch according to anotherembodiment of my invention; and

FIG. 6 is a view similar to FIG. l of the bonding film according tostill another embodiment of my invention.

In FIGS. l and 2 I show a fabric 10 having a hole 11 which is to bepatched. Loose threads in the vicinity of this hole are removed and apatch 13 of the same material as fabric 10 is cut. The patch 13 isdimensioned to overlie the hole 11 with a substantial marginal portionsurrounding this hole. A piece of bonding material 12, of the same sizeas the patch 13, is provided with a centrally disposed hole 14 of thesame size and configuration v as the hole 11. The bonding material 12comprises a thermally softenable polymeric adhesive film 17 cast onto afiat substrate 16 which is preferably a sheet or strip of paper treatedat least on its surface with a thermosensitive l release material suchas wax or a silicone. To render the bonding foil 12 permeable to fluids,I perforate the substrate-backed adhesive so as to obtain a network ofpores 15. The latter are made of sufficiently large diameter to obviatethe closing of the pores during the application of heat and/ orpressure.

To form the patch, I prefer to rest the compound bonding foil 12, withits adhesive lm 17 facing upwardly, on a at surface. The patchingmaterial 13 is then placed over the adhesive film 17 and subjected toheat and a moderate amount of pressure by an iron to form a composite bybonding the patch 13 to the foil. Next, the releasing agent interposedbetween the film 17 and the substrate 16 is sufficiently softened ordecomposed by the heat to permit the backing element or substrate 16 tobe peeled from the adhesive film 17, as shown in FIG. 4. After thesubstrate is stripped from the film 17, the latter is placed face downon the inner surface of the fabric 10 so that the hole 14 in theadhesive is aligned with the opening 11 in the fabric 10 whereby none ofthe adhesive `line of the hole exactly matches that of area 14.

f D film may be seen through the opening. A hot iron is then used tobind the patch to the fabric vis the thermal adhesive 17. The weaves ofthe patch 13 and the fabric 10'are, of course, matched before the patchis affixed to `the fabric.

In FIG. 5 I show the patch 13 having a bonding foil 12 applied to it bythe process described above. The foil 12 comprises a removable substrate16', treated with a thermally activatable release agent, on which theadhesive tilrn 17' has been cast. The adhesive 17 is chemically removedat selected portions (which may include an area co-extensive with thehole 11 in the textile 10 to be repaired, cf. FIG. 2) prior to applyingthe Vfoil 12.

FIG. 6 illustrates an annular foil 12", of the type previ- `ouslydescribed, wherein a central hole 14 is formed during manufacture ofthis ring. The latter, adapted to be used for patching holes of maximumdiameters not larger than that of the adhesive-free area 14"; if thehole to be mended is smaller than that area, it may be cut to size bythe operator before mending, if not, the peripheral portions of thefabric will subsequently fray until the out- The perforations 15" shouldbe numerous enough to permit a satisfactory penetration of the patch byfluids. Thus, the permeability of the patch may equal or exceed that ofthe surrounding fabric.

It will be understood that a patch, according to my invention, may alsobe used to join adjacent strips of fabric. The large openings 14 and 14"may thus be dispensed with. The patching foil is, however, renderedpermeable to fluids as described above so that the joining seam hasessentially the same permeability as the adjacent portions Aof thefabric.

The invention as illustrated and described is believed to come withinits spirit and scope as dened in the appended claims.

I claim:

1. A method of mending a hole in a fabric, comprising the steps offorming a compound foil by coating a backing element with a layer ofthermally activatable adhesive with interposition of a heat-responsivereleasing agent therebetween, removing at least said adhesive layer overan area substantially co-extensive with said hole, thermally bonding tosaid layer a patch of material matching said fabric with said patchoverlying said area, exposing said layer by stripping said backingelement from the composite thus obtained, applying said patch to saidfabric with said layer contacting the latter and with said area inregistry with said hole whereby the material of said patch substantiallyblends with said fabric in the region of said hole, and bonding saidfabric onto said patch by heat and pressure.

2. A method of mending a hole in a fabric, comprising the steps offorming a compound foil by coating a backing element with a layer ofthermally activatable adhesive with interposition of a heat-responsivereleasing agent therebetween, removing at least said adhesive layer overan area substantially co-extensive with said hole, perforating at leastsaid layer at a multiplicity of locations surrounding said area,thermally bonding to said layer a patch of a material matching saidfabric with said patch overlying said area and said locations, exposingsaid layer by stripping said backing element from the composite thusobtained, applying said patch to said fabric with said layer contactingthe latter and with said area in registry with said hole whereby thematerial of said patch substantially blends with said fabric in theregion of said hole, and bonding said fabric onto said patch by heat andpressure.

3. A method of mending a hole in a fabric, comprising the steps ofremovably securing a patch of a material matching said fabric to abacking element with interposition of a layer of thermally activatableadhesive, removing said layer from an area substantially co-extensivewith said hole and covered by said patch, exposing said layer bystripping said backing element from the composite thus obtained,applying said patch to said fabric with said layer contacting the latterand with said area in registry with said hole whereby the material ofsaid patch substantially blends with said fabric in the region of saidhole, and bonding said fabric onto said patch by heat and pressure.

4. A method of mending a hole in a fabric, comprising the steps ofcoating a backing element With a layer of thermally activatable adhesivewith interposition of a heatresponsive releasing agent therebetween,perforating the backing element so coated over an area substantiallycoextensive with said hole and at a multiplicity of locationssurrounding said area, thermally bonding to said layer a patch of amaterial matching said fabric with said patch overlying said area andsaid locations, exposing said layer by stripping said backing elementfrom the composite thus obtained, applying said patch to said fabricwith said layer contacting the latter and with said area in registryWith said hole whereby the material of said patch substantially blendswith said fabric in the region of said hole, and bonding said fabriconto said patch by heat and pressure.

References Cited in the file of this patent UNITED STATES PATENTS1,113,030 McLaurin Oct. 6, 1914 1,667,689 Grupe Apr. 24, 1928 1,955,083Muller Apr. 17, 1934 1,967,923 Connolly July 24, 1934 2,101,607 BlockDec. 7, 1937 2,354,248 Dreyfus July 25, 1944 2,716,625 Scholl Aug. 30,1955 2,725,322 Muttera Nov. 29, 1955

1. A METHOD OF MENDING A HOLE IN A FABRIC, COMPRISING THE STEPS OFFORMING A COMOUND FOIL BY COATING A BACKING ELEMENT WITH A LAYER OFTHERMALLY ACTIVATABLE ADHESIVE WITH INTERPOSITON OF A HEAT-RESPONSIVERELEASING AGENT THEREBETWEEN, REMOVING AT LEAST SAID ADHESIVE LAYER OVERAN AREA SUBSTANTIALLY CO-EXTENSIVE WITH SAID HOLE, THERMALLY BONDING TOSAID LAYER A PATCH OF MATERIAL MATCHING SAID FABRIC WITH SAID PATCHOVERLYING SAID AREA, EXPOSING SAID LAYER BY STRIPPING SAID BACKINGELEMENT FROM THE COMPOSITE THUS OBTAINED, APPLYING SAID PATCH TO SAIDFABRIC WITH SAID LAYER CONTACTING THE LATTER AND WITH SAID AREA INREGISTRY WITH SAID HOLE WHEREBY THE MATERIAL OF SAID PATCH SUBSTANTIALLYBLENDS WITH SAID FABRIC IN THE REGION OF SAID HOLE, AND BONDING SAIDFABRIC ONTO SAID PATCH BY HEAT AND PRESSURE.